Advisors: Harold Chong [Postgraduate Graduation Design]
This project investigates and designs the structure of MEMS switches suitable for harsh environments (high temperature) and uses COMSOL software to model and develop finite element analysis of electrostatic MEMS switches with different geometrical parameters and different materials at different operating temperatures. Based on the MEMS add-on module and the heat-transfer add-on module of COMSOL software, the coupling equations describing the structural deformation and the electric field are solved using the electromechanical multi-physics field interface of COMSOL software, and and the performance indicators such as pull-in voltage of different types of MEMS switches are simulated and evaluated.
